2024 International Conference on Electrical, Electronic, and Mechatronics Integration

WELCOME TO ICEEMI 2024 !
  • 58
    DAY
  • 18 HOUR
  • 23 MINUTE
  • 33 SECONDS
IMPORTANT DATES
  • 1
  • 2
  • 3
  • 4
  • Submission Deadline 2024-09-23
  • Registration Deadline 2024-09-30
  • Conference Date 2024-10-07
  • Notification Date About a week after the submission
- About to ICEEMI 2024-
The 2024 International Conference on Electrical, Electronic and Mechatronics Integration is about to grandly open, which is an academic feast that gathers elites in the field of global electrical, electronic and mechatronics integration. The purpose of this meeting is to explore the latest developments in electrical and electronic technology, as well as innovative applications and development trends in the field of mechatronics. The conference will cover multiple fields such as power systems, electronic technology, automation control, and intelligent sensing, providing participants with a platform for in-depth communication and sharing of wisdom. Attendees will have the opportunity to listen to cutting-edge industry reports, participate in thematic discussions, and jointly promote technological progress in the fields of electrical, electronic, and electromechanical integration. This conference is not only a platform for academic exchange, but also an important opportunity to promote technological innovation and industrial upgrading. We look forward to discussing with you the future of electrical, electronic, and electromechanical integration, injecting new vitality into the industry's development.
- CALL FOR PAPERS -
(Including but not limited to the following topics)
Wireless communication technology Signal processing in communication systems Nanotechnology in electronic devices Internet Security and Encryption Technology Electronic Design Automation and Simulation Power System Automation and Monitoring Integration of Power Electronics and Smart Grid Quantum computing for data security High performance computing for electronic design Embedded System Design for IoT Devices Image and audio processing based on DSP Advanced PCB design and layout technology Biomedical Electronics and Wearable Health Technologies Artificial intelligence driven energy management solutions Artificial Intelligence Application Neural Network Based on FPGA Human computer interaction and collaboration Mechanical and Electrical Education and Education Mechanical and Electrical System Design and Modeling Robotics and Automation Technology Integration and testing of electromechanical systems Embedded systems and real-time control Mechatronics Integrated Intelligent Control System Integration of electromechanical sensors and sensors Sensing and driving in mechatronics integration Motion planning and trajectory generation of robots Control and Optimization of Mechatronics Integration System Biomedical electromechanical integration and medical devices Manufacturing and Industry 4.0 Mechatronics Integration Renewable energy and sustainable electromechanical integration Micro electromechanical systems/nano electromechanical systems and micro nano robots [All relevant topics are eligible for submission]
-record-
All full paper submissions to the www.iaceemi.com could be written in English and will be sent to at least two reviewers and evaluated based on originality, technical or research content or depth, correctness, relevance to conference, contributions, and readability. All accepted papers of www.iaceemi.com will be published in the conference proceedings, which will be submitted to EI Compendex, Scopus for indexing.
-Submission Portal-
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
龚老师 | TEL:19980549041 (微信同号) | QQ:1841942468 | E-mail:iceemi@sub-paper.com |
Submission Guidelines

Paper template

Please refer to the paper template for layout

Click to download >>

Register

All attendees must register in advance to attend the meeting

Consulting service >>

Submit

Please submit the full text/abstract of the paper to us through the electronic submission system

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Indexing Service
Technical Sponsor

中文特别声明

出版社在论文出版前会对论文重复率进行检测,重复率大于20%的稿件将被拒绝出版;重复率不大于20%的稿件中,如有整段大面积的直接复制其他作者文章内容的情况,也会被拒绝出版。以上两种涉及抄袭的情况,一旦被出版社证实,文章将被拒绝出版,并且不退回任何会议注册费用。

-About Plagiarism Check-

Crosscheck Powered by iThenticate will be used for plagiarism check. The amount of duplication from previously published content should be less than 20%; If the amount of duplication is 20% - 35%, modification maybe required; if the amount of duplication exceeds 35%, the article will be rejected. Please note that there will be no refund for no-shows.
Call for Reviewers
As a platform for global academic communication, the quality of conference publication has always an aspect attracting much of our attention. To ensure quality of our publication and to better serve the peers in academic circle, we now call for reviewers among professionals and experts of the world. Professionals and experts who hold PhD (doctoral) degree in the conference related areas are encouraged to join in us and together, we will work hard to become a world-class academic conference. Please send us your CV by email (iceemi@sub-paper.com) if you are interested in it.
SCI JOURNAL
Contributors are encouraged to submit papers / abstracts to the conference. The organizing committee will select high-quality papers and recommend them to SCI/SSCI journals. For specific matters, please contact the person in charge of the conferrence.
Submission Guidelines
Delegates are encouraged to submit their papers/abstracts to the conference. Good quality papers will be selected by the organizing committee and Prof. Soteris Kalogirou, the editor in chief. After it, the authors will be invited to extent their papers/abstracts and submit them to iceemi@sub-paper.com. The normal size of research papers is 4,000-6,000 words excluding abstract and references.