2024 International Conference on Electrical, Electronic, and Mechatronics Integration

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IMPORTANT DATES
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  • Submission Deadline 2024-12-04
  • Registration Deadline 2024-12-11
  • Conference Date 2024-12-18
  • Notification Date About a week after the submission
ORGANIZING COMMITTEES
Conference Committee Prof. Seeram Ramakrishna, National University of Singapore, Singapore. Prof. Weidong Zhu, University of Maryland, USA. Prof. David BASSIR, University of Bourgogne Franche-Comté (UTBM) & Researcher at ENS-CMLA,France. Prof. Seeram Ramakrishna, National University of Singapore, Singapore. A.P. LIU Erjia, National University of Singapore, Singapore. Program Committee Prof. Samir Ladaci, National Polytechnic School of Algeria, Algeria Prof. Osama Mohammed, Florida International University, America Prof. Sergey Leonov, Tomsk Polytechnic University, Russia Prof. Merih Palandoken, Izmir Katip Celebi University, Turkey Prof. Md Mozasser Rahman, Universiti Tun Hossein Onn Malaysia, Malaysia Prof. Ghous Bakhsh, Pakistan International Technical Committee Prof. Sergio Vázquez, University of Seville, Franch Prof. Raghvendra Chaudhary, Indian Institute of Technology Kanpur, India Prof. Ramandeep Kaur, Punjabi University, India Prof. Muhammad Zubair, Information Technology University, Pakistan Prof. Dr. Yasuto Hijikata,Saitama University, Japan Prof. Eckart H. Meiburg, University of California, Santa Barbara Prof. DAVID BASSIR,French University of Technology,France Prof. Volkan Kahya, Karadeniz Technical University, Turkey Prof. David E. Esezobor, University of Lagos, Nigeria prof. Nour F. Attia, National Institute of Standards (NIS), Egypt Prof. Mohamed Ahmed Ramadan-Faculty of Engineering at Helwan, Helwan University, Egypt Dr. Quah Hock Jin , University Sains Malaysia, Malaysia Dr. Alexander Lukin ,Western-Caucasus Research Center, Russian Federation Dr. R. RANJITH KUMAR,Viyen Biotech LLP, India Dr. Hicham Bakkali, University of Cadiz, Spain Dr. P K Dash,NMIT, India